| Processor |
Broadcom BCM2712 SoC with four 64-bit Arm Cortex-A76 CPU cores at up to 2.4 GHz; soldered to the board. |
Intel/AMD x86-64 CPUs are common. Many serviceable desktops use a replaceable CPU installed in a motherboard socket. |
Laptop: Intel/AMD x86-64 is common, while Arm-based laptops also exist. Modern laptop CPUs are often soldered to the system board. Phones/tablets: commonly use soldered Arm-based SoCs. |
Architecture, cores, clock speed, SoC vs. discrete components, socketed vs. soldered |
| Memory |
LPDDR4X memory is soldered to the Pi board and is not a user-replaceable module. |
Usually replaceable full-size DIMMs in motherboard memory slots. |
Laptop: serviceable models may use smaller SO-DIMMs; many thin laptops use soldered LPDDR/DDR memory. Phones/tablets: memory is normally soldered/integrated and not upgradeable. |
DIMM vs. SO-DIMM, DDR generations, capacity, channels, soldered vs. replaceable RAM |
| Storage |
microSD is common; USB storage and PCIe-connected M.2 storage can also be used with appropriate hardware. |
M.2 NVMe SSD and SATA SSD/HDD are common, with multiple drives possible. |
Laptop: M.2 NVMe is common; some systems also use 2.5-inch SATA drives. Phones/tablets: internal flash storage is usually soldered; some devices support removable flash media. |
HDD vs. SSD, SATA vs. PCIe/NVMe, removable vs. soldered storage, capacity and speed |
| Power |
External USB-C DC power; Pi 5 is designed for 5 V power input and can use the official 27 W USB-C supply. |
Internal ATX/SFX PSU converts wall AC to multiple DC rails and distributes power through dedicated connectors. |
Laptop: external AC/USB-C adapter plus an internal rechargeable battery. Phones/tablets: rechargeable battery with USB-C common on modern devices; charging/power management is highly integrated. |
AC vs. DC, adapters, batteries, power connectors, symptoms of insufficient power |
| Display |
External displays connect through micro-HDMI; dedicated camera/display connectors are also available. |
External monitor(s) typically use HDMI/DisplayPort from integrated graphics or a GPU. |
Laptop: built-in LCD/OLED panel connects internally, often through eDP, with external display ports also possible. Phones/tablets: built-in touch display is tightly integrated. |
Internal vs. external displays, HDMI/DisplayPort, resolution, refresh rate, touch/display troubleshooting |
| Networking |
Built-in Wi-Fi/Bluetooth and Gigabit Ethernet. |
Ethernet plus Wi-Fi/Bluetooth are common. |
Laptop: Wi-Fi/Bluetooth are standard; Ethernet may be built in or require an adapter/dock. Phones/tablets: Wi-Fi/Bluetooth plus cellular on supported models; wired Ethernet typically requires an adapter. |
NICs, WLAN, Bluetooth, Ethernet, wireless/mobile connectivity, adapters |
| Expansion / I/O |
USB, 40-pin GPIO, PCIe FFC, camera/display connectors, and HAT accessories. |
PCIe slots, USB, SATA, M.2, front-panel headers, add-in cards, and internal bays. |
Laptop: fewer internal expansion options; USB/USB-C/Thunderbolt and docks are important. Phones/tablets: expansion is mostly external accessories, wireless connections, and cloud services. |
Ports, connectors, adapters, docks, expansion cards, mobile accessories |
| Cooling |
Can use a case fan or active cooler; sustained workloads benefit from effective cooling. |
CPU/GPU heat sinks, case fans, liquid/air cooling, and larger airflow paths are common. |
Laptop: compact heat pipes/vapor chambers and small fans are common. Phones/tablets: usually rely on passive heat spreading and tightly managed power/thermal limits. |
Thermal management, airflow, throttling, fan/heat-sink troubleshooting |
| Input |
External USB/Bluetooth keyboard, mouse, controller, sensors, etc. |
External keyboard/mouse and other peripherals. |
Laptop: built-in keyboard/touchpad plus webcam/microphone. Phones/tablets: touch, on-screen keyboard, cameras, microphones, sensors, and voice input. |
Peripherals, touchscreens, cameras, microphones, input troubleshooting |